Download Advances in Semiconducting Materials by S. Velumani and René Asomoza PDF

By S. Velumani and René Asomoza

ISBN-10: 0878493239

ISBN-13: 9780878493234

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As XRD analysis shows, this product consists of NiAl2O4 spinel. When the same conditions (1300°C for 3 h) were used under an Ar+1%H2 gas mixture, significant changes in the crack are observed, as shown in Fig. 4 (c). Moreover, the XRD pattern did not show the NiAl2O4 spinel peaks. Considering the above-mentioned facts, it can be easily understood that the crack filling material is NiAl2O4 spinel. 38 Advances in Semiconducting Materials Fig. 4. X-ray profiles and SEM images from Ni/Al2O3 nanocomposites for (a) as-sintered sample, (b) after 1300ºC/ 3 h in air, and (c) 1300ºC / 3 h under Ar+1%H2 atmosphere.

5 µm in sizes can be appreciated before and after sintering process. Fig. 1. SEM micrograph of (a) nanocomposite powder and (b) fracture surface of Ni/Al2O3 nanocomposites sintered at 1400˚C for 5 min using PECS. The sintered disc was cut into 3mm x 4 mm x 15mm rectangular specimen bars and the beam surface was polished to a mirror quality with diamond slurry. In order to investigate the crack disappearance function of the composites three indentations and derived cracks were introduced on the sample polished surface using a Vickers hardness indenter at a load of 49 N by 10 s.

Absence of peaks of NiO in the XRD profiles indicates that oxidation reaction of Ni particles in the Al2O3 matrix follows the equilibrium phase relation as follows [15]: Al2O3 + Ni + ½O2 ↔ NiAl2O4 (1) S. Velumani and René Asomoza 39 Based on the ternary phase diagram of Ni-Al-O [17], NiO does not coexist with Al2O3. Therefore, crack disappearance in Ni/Al2O3 composites is the result of NiAl2O4 spinel formation on the surface. Fig. 5 (a) shows a cross-section view of Ni/Al2O3 composite oxidized at 1300°C for 12 h in air.

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